Add: C3 Building, Yabian Industrial Park, Shajing Street, Baoan District, Shenzhen, China
Tel: 86-136-99856040
Tel: 86-180-26686040
Fax: 86-755-26231618
Web: www.newlytrend.com
Email: info@newlytrend.com
Copper Clad FR4
Copper Clad FR4 is an excellent material commonly used for Printed Circuit Board (PCB) fabrication. The fiberglass substrate is a flame retardant (FR4) laminate, typically translucent in color and made of a continuous fine weave woven glass cloth. The fiberglass cloth is then impregnated with epoxy resin, and the copper foil material is adhered through an electroplating process. The copper is measured in microns or ounces per square foot and measures .00134" thick per ounce or 34.1 microns.
Copper Clad PC Boards can be clad double-sided or single-sided. The copper is commonly available in 1/2 oz, 1 oz, and 2 oz weights, although heavier weights are available. Copper can be clad up to 6 ounces while still maintaining a very strong dielectric strength. The FR4 material substrate can be made in yellow, white or black for high end optical applications or aesthetic applications.
A. The details of our copper clad fr4
General Data |
Core Layer Color |
white,yellow,black |
Sheets Thickness(mm) |
0.2mm-4mm |
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Copper thickness |
18 μm(1/2 oz),35μm(1 oz),or customized |
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Stock Size (inch) |
41''X49'', 43"X49", other sizes can be customized |
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Packing |
1. Wooden pallet with carton. |
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2. Plastic pallet with carton. |
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3. Wooden Case |
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4. According to customer requirements. |
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Sample |
1.sample time: wthin 3-7 days |
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2.Sample charge:According to product details |
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3.Send sample:Via DHL, TNT, UPS, Fedex |
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4.Small size sample can be free given if you need it for testing the quality |
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Payment |
TT or Western Union |
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Delivery Time |
7-15 days according to the order quantity |
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Shipping Port |
Shenzhen |
B. Data sheet:
Item |
Test condition |
Unit |
SPEC |
Typical Value |
|
Tg |
DSC |
°C |
≥170 |
175.2
|
|
Peel strength(1OZ) |
288°C,10S |
N/mm |
≥1.05 |
1.41 |
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Thermal Stress |
288°C,10S/solder dip |
____ |
No delamination |
180S/ No delamination
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Flammability |
N/mm2 |
LW |
≥415 |
580 |
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CW |
≥345 |
482 |
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Surface Resistivity |
After moisture |
MΩ |
≥1. 0×104 |
2,52×107 |
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Volume Resistivity |
After moisture |
MΩ.cm |
≥1.0×105 |
3.21×108 |
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Dielectric Constant |
1MHz C-24/23/50 |
____ |
≤5.4 |
4.7 |
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Loss Tangent |
1MHz C-24/23/50 |
____ |
≤0.035 |
0.016 |
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Arc Resistivity |
D-48/50+D-0.5/23 |
S |
≥60 |
122 |
|
Dielectric Breakdown |
D-48/50+D-0.5/23 |
KV |
≥40 |
58 |
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Moisture Absorption |
D-24/23 |
% |
≤0.5 |
0.1 |
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Td |
Weight loss 5% |
°C |
340 |
347 |
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CTE Z—axis |
Alpha 1 |
TMA |
ppm/°C |
≤60 |
45 |
Alpha 2 |
ppm/°C |
≤300 |
270 |
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50-260°C |
% |
≤3.0 |
2.9 |
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T288
|
TMA |
min |
≥15 |
30 |
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CTI |
IEC60112 Method |
V |
175~250(Grade 3) |
200 |
C. The inspection of copper clad fr4
1.The end face of foil covered board should be tidy without any delamination and crackle .
2. Any bubble, wrinkle, pin hole, deep nick, pitting and glue spot on the copper foil covered face is not allowed. Any color changing or dirty can be easily removed by density 1.02g/cm3 hydrochloric acid or proper organic solution.
3.On laminated face, the defects such as bubble, impressed pitting, nick and glue lack and outer impurity which retard its use are not allowed .
D. Suggestion for use
Please baking the laminate at 150°C,2 hours before using.
Please pay attention to the machining for the interbedded energy is lower than the normal FR-4.Rilling parameters are mainly dependent on hole size ,layer thickness, layer number ,copper thickness and stack height.
The following drilling parameters are for reference only .Typical drilling parameters for 0.4 ~1.0mm drills are as follows:
speed :45 ~105 KRPM
Feed rate:50~150 IPM
Retract rate:;500~1000 IPM
Suggest hit count:1500 HITS
Stack height:≤2pnls(2~6 layers), 1pnls(≤8 layers)