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Add: C3 Building, Yabian Industrial Park, Shajing Town, Baoan District, Shenzhen, China

Cell: 86-13699856040

Tel:  86-755-27259346

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High performance aluminum copper clad laminate

High performance aluminum copper clad laminate

Aluminum based copper clad laminate sheet


Aluminum based copper clad laminate have excellent flame retardant, high mechanical strength, dimensional stability etc. Especially it has very good heat sink, electromagnetic shielding and solder float.

General Data

Copper type

Rolled or electroformed

Sheets Thickness(mm)


Copper thickness

18 μm(1/2 oz),35μm(1 oz),or Customized

Stock Size (mm)

1000x1200mm, other sizes can be customized


1. Wooden pallet with carton.

2. Plastic pallet with carton.

3. Wooden wooden pallet with wooden case.

4. According to customer requirements.


1.sample time: wthin 3-7 days

2.Sample charge:According to product details

3.Send sample:Via DHL, TNT, UPS, Fedex

4.Small size sample can be free given if you need it for testing the quality


TT or Western Union

Delivery Time

7-15 days according to the order quantity

Shipping Port



A. Advantage of Aluminum based copper clad laminate sheet

1. Excellent thermal conductivity

2. Excellent dimensional stability

3. Excellent mechanical properties

4. Excellent electromagnetic shielding

5. Can use external cooling device directly

6. Good cost performance


B. The inspection of Aluminum based copper clad laminate sheet ?

1.The end face of foil covered board should be tidy without any delamination and crackle .
2. Any bubble, wrinkle, pin hole, deep nick, pitting and glue spot on the copper foil covered face is not allowed. Any color changing or dirty can be easily removed by density 1.02g/cm3 hydrochloric acid or proper organic solution .
3.On laminated face, the defects such as bubble, impressed pitting, nick and glue lack and outer impurity which retard its use are not allowed .



C.What are the Applications of aluminum based copper clad laminate sheet ?

It's widely used for LED lighting circuit, power supply, hybrid integrated circuits, solid State Relays, LCD Backlights and the area needs high heat dissipation.