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Aluminum based copper clad laminate

Aluminum based copper clad laminate

Aluminum based copper clad laminate sheet

 

Aluminum based copper clad laminate have excellent flame retardant, high mechanical strength, dimensional stability etc. Especially it has very good heat sink, electromagnetic shielding and solder float.


General Data

Copper type

Rolled or electroformed

Sheets Thickness(mm)

0.6mm-3mm

Copper thickness

18 μm(1/2 oz),35μm(1 oz),or Customized

Stock Size (mm)

1000x1200mm, other sizes can be customized

Package

1. Wooden pallet with carton.

2. Plastic pallet with carton.

3. Wooden wooden pallet with wooden case.

4. According to customer requirements.

Sample

1.sample time: wthin 3-7 days

2.Sample charge:According to product details

3.Send sample:Via DHL, TNT, UPS, Fedex

4.Small size sample can be free given if you need it for testing the quality

Payment

TT or Western Union

Delivery Time

7-15 days according to the order quantity

Shipping Port

Shenzhen

 

A. Advantage of Aluminum based copper clad laminate sheet

1. Excellent thermal conductivity

2. Excellent dimensional stability

3. Excellent mechanical properties

4. Excellent electromagnetic shielding

5. Can use external cooling device directly

6. Good cost performance

 

主要性能 Main property 
典型值 Typical Value
项目
Item
处理条件
Test condition
单位
Units
指标值
Spec
类型 1 / Type1  类型 2 / Type2
热导率
Thermal Conductivity
A
ASTM 5470-D
W/ M·K  1.0-2.0  1.3  2.0
A  1.95  1.64
剥离强度 1OZ
Peel Strength
热应力后
N/mm  ≥1.2
1.85  1.53
热应力 Thermal Stress  288℃,solder dip  S  ≥120
180S
No delamination
180S
No delamination
C96/35/90  ≥10 4 10 6 10 6
表面电阻
Surface Resistivity
E-24/125
MΩ
≥10 3 10 5 10 5
C96/35/90  ≥10 6 10 7 10 7
体积电阻
Volume Resistivity
E-24/125
MΩ·cm
≥10 3 10 5 10 5
电气强度
Elecctrical Strength
A
IPC-TM-650 2.5.6.2
KV/mm  ≥20  30  30
介电常数(1MHz)
Dielectric Constant
C 24/23/50
IPC-TM-650 2.5.5.2
—  —  7.0  7.0
耐电弧
Arc Resistance
D48/50+D0.5/23
IPC-TM-650 2.5.1
S  ≥60  120  120
燃烧性 Flammability  E-24/125  —  V-0  V-0  V-0
Tg  DSC  ℃  ≥110 121.2  122.6
吸水率
Water Absorption
D-24/23
IPC-TM-650 2.6.2.1
%  ≤1.0  0.52  0.43
CTI  IEC60112  V  ≥175  200  200
* 热导率为绝缘层介质的热导率;
* Thermal conductivity is the parameters of thermally conductive dielectric layer.

 

B. The inspection of Aluminum based copper clad laminate sheet ?

1.The end face of foil covered board should be tidy without any delamination and crackle .
2. Any bubble, wrinkle, pin hole, deep nick, pitting and glue spot on the copper foil covered face is not allowed. Any color changing or dirty can be easily removed by density 1.02g/cm3 hydrochloric acid or proper organic solution .
3.On laminated face, the defects such as bubble, impressed pitting, nick and glue lack and outer impurity which retard its use are not allowed .

 

 

C.What are the Applications of aluminum based copper clad laminate sheet ?

It's widely used for LED lighting circuit, power supply, hybrid integrated circuits, solid State Relays, LCD Backlights and the area needs high heat dissipation.