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Copper Clad FR4 Laminate

Copper Clad FR4 Laminate

Copper Clad FR4 Laminate

 

Copper Clad FR4 is an excellent material commonly used for Printed Circuit Board (PCB) fabrication.  The fiberglass substrate is a flame retardant (FR4) laminate, typically translucent in color and made of a continuous fine weave woven glass cloth.  The fiberglass cloth is then impregnated with epoxy resin, and the copper foil material is adhered through an electroplating process.  The copper is measured in microns or ounces per square foot and measures .00134" thick per ounce or 34.1 microns.

 

Copper Clad PC Boards can be clad double-sided or single-sided.  The copper is commonly available in 1/2 oz, 1 oz, and 2 oz weights, although heavier weights are available.  Copper can be clad up to 6 ounces while still maintaining a very strong dielectric strength. The FR4 material substrate can be made in yellow, white or black for high end optical applications or aesthetic applications.   

 

A. The details of our copper clad fr4 laminate

General Data

Core Layer Color

white,yellow,black

Sheets Thickness(mm)

0.2mm-4mm

Copper thickness

18 μm(1/2 oz),35μm(1 oz),or customized

Stock Size (inch)

41''X49'', 43"X49", other sizes can be customized

Packing

1. Wooden pallet with carton.

2. Plastic pallet with carton.

3. Wooden Case

4. According to customer requirements.

Sample

1.sample time: wthin 3-7 days

2.Sample charge:According to product details

3.Send sample:Via DHL, TNT, UPS, Fedex

4.Small size sample can be free given if you need it for testing the quality

Payment

TT or Western Union

Delivery Time

7-15 days according to the order quantity

Shipping Port

Shenzhen

 

B. Data sheet:

Item

Test condition

Unit

SPEC

Typical Value

Tg

DSC

°C

170

175.2

 

Peel strength(1OZ)

288°C,10S

N/mm

1.05

1.41

Thermal Stress

288°C,10S/solder dip

____

No delamination

180S/ No delamination 

 

Flammability

N/mm2

LW 

                         ≥415

580

CW

                         ≥345

482

Surface Resistivity

After moisture

1. 0×104

2,52×107

Volume Resistivity

After moisture

MΩ.cm

1.0×105

3.21×108

Dielectric Constant

1MHz C-24/23/50

____

5.4

4.7

Loss Tangent

1MHz   C-24/23/50

____

0.035

0.016

Arc Resistivity

D-48/50+D-0.5/23

S

60

122

Dielectric Breakdown

D-48/50+D-0.5/23

KV

40

58

Moisture Absorption

D-24/23

%

0.5

0.1

Td

Weight loss 5%

°C

340

347

CTE

Zaxis

Alpha 1

TMA

ppm/°C

60

45

Alpha 2

ppm/°C

300

270

50-260°C

%

3.0

2.9

T288

 

TMA

min

15

30

CTI

IEC60112 Method

V

175~250(Grade 3)

200

 

C. The inspection of copper clad fr4 laminate

1.The end face of foil covered board should be tidy without any delamination and crackle .

2. Any bubble, wrinkle, pin hole, deep nick, pitting and glue spot on the copper foil covered face is not allowed. Any color changing or dirty can be easily removed by density 1.02g/cm3 hydrochloric acid or proper organic solution.

3.On laminated face, the defects such as bubble, impressed pitting, nick and glue lack and outer impurity which retard its use are not allowed .

 

D. Suggestion for use

Please baking the laminate at 150°C,2 hours before using.

Please pay attention to the machining for the interbedded energy is lower than the normal FR-4.Rilling parameters are mainly dependent on hole size ,layer thickness, layer number ,copper thickness and stack height.

The following drilling parameters are for reference only .Typical drilling parameters for 0.4 ~1.0mm drills are as follows:

speed :45 ~105 KRPM    

Feed rate:50~150 IPM

Retract rate:;500~1000 IPM

Suggest hit count:1500 HITS

Stack height:≤2pnls(2~6 layers), 1pnls(≤8 layers)