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FR-4 fiberglass epoxy insulation sheet

 FR-4 fiberglass epoxy insulation sheet

FR-4 fiberglass epoxy insulation sheet

 

Standard size: 1020X1220mm, 1000x2000mm, other sizes can be customized.

Thickness: 0.1mm-30mm

Color: Yellow, light green, white and black.

 

I. Define and purpose

FR-4 fiberglass epoxy insulation sheet is formed through heat pressing after electric industry alkali glass cloth dips into the epoxy resin. It has high mechanic and dielectric performance, applicable as insulation structural components for electromechanical/electrical equipment, as well as used under damp environmental conditions and in oil of transformer. And it can Withstand a variety of chemical solvents and acid erosion.

 

II.Technical requirement for surface

The surface shall tidy and smooth, bubble, impurity are not allowed. But slight scratch and color punctum are allowed. Edge is to be cut smooth. The delamination and crackle on the end surface are not allowed .

 

III. Properties

1.Higher mechanical properties, 
2.Dielectric properties. 
3.Good heat/Moisture  resistance .

4.Stable electric performance in high temperature.


 Typical physical and electrical properties of FR-4 are as follows. LW (length wise, warp yarn direction) and CW (cross wise, fill yarn direction) refer to the fiber orientations in the plane of the board (in-plane) that are perpendicular to one another. The through-plane direction is also referred to as the z-axis.

ParameterValue
Specific gravity/density 1,850 kg/m3 (3,120 lb/cu yd)
Water absorption −0.125 in < 0.10%
Temperature index 140 °C (284 °F)
Thermal conductivity, through-plane 0.29 W/m·K, 0.343 W/m·K
Thermal conductivity, in-plane 0.81 W/m·K, 1.059 W/m·K
Rockwell hardness 110 M scale
Bond strength > 1,000 kg (2,200 lb)
Flexural strength (A; 0.125 in) - LW > 440 MPa (64,000 psi)
Flexural strength (A; 0.125 in) - CW > 345 MPa (50,000 psi)
Tensile strength (0.125 in) LW > 310 MPa (45,000 psi)
Izod impact strength - LW > 54 J/m (10 ft·lb/in)
Izod impact strength - CW > 44 J/m (8 ft·lb/in)
Compressive strength - flatwise > 415 MPa (60,200 psi)
Dielectric breakdown (A) > 50 kV
Dielectric breakdown (D48/50) > 50 kV
Dielectric strength 20 MV/m
Relative permittivity (A) 4.8
Relative permittivity (D24/23) 4.8
Dissipation factor (A) 0.017
Dissipation factor (D24/23) 0.018
Dielectric constant permittivity 4.70 max., 4.35 @ 500 MHz4.34 @ 1 GHz
Glass transition temperature Can vary, but is over 120 °C
Young's modulus - LW 3.5×106 psi (24 GPa)
Young's modulus - CW 3.0×106 psi (21 GPa)
Coefficient of thermal expansion - x-axis 1.4×10−5 K−1
Coefficient of thermal expansion - y-axis 1.2×10−5 K−1
Coefficient of thermal expansion - z-axis 7.0×10−5 K−1
Poisson's ratio - LW 0.136
Poisson's ratio - CW 0.118
LW sound speed 3602 m/s
SW sound speed 3369 m/s
LW Acoustic impedance 6.64 MRayl

IV. Applications

Printed circuit boards

FR-4 is the primary insulating backbone upon which the vast majority of rigid printed circuit boards (PCBs) are produced. A thin layer of copper foil is laminated to one, or both sides of an FR-4 glass epoxy panel. These are commonly referred to as "copper clad laminates."


FR-4 copper-clad sheets are fabricated with circuitry interconnections etched into copper layers to produce printed circuit boards. More sophisticated and complex FR-4 printed circuit boards are produced in multiple layers, also known as "multilayer circuitry".